TNG3CXCS02

Huawei OSN 9800 M24 higher-order cross-connect board

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Description

TNG3CXCS02 higher-order cross-connect board

Applied to Huawei OSN 9800 M24, it supports centralized cross-connections of electrical signals

TNG3CXCS02 board Performs centralized grooming of ODUk (k = 0, 1, 2, 2e, 3, 4, or flex)/VC-4/Packet/OSUflex signals in the subrack

TNG3CXCS02 board supports Electrical-layer ASON.

The TNG3CXCS02 board is a higher-order cross-connect board. It grooms and protects ODUk (k = 0, 1, 2, 2e, 3, 4, or flex)/VC-4/Packet/OSUflex signals in the subrack.

Tech Specs
Front Panel
TNG3CXCS
Valid Slots
OptiX OSN 9800 M24 subrack: (IU6, IU18), (IU7, IU19)
Initial Version of Different Subrack
V100R007C00SPC700
Function and Feature Description
Cross-connect capacity Two small slots can be combined into one large slot. A small slot is 5.5-U high, and a large one is 11-U high.
The ODUk (k = 0, 1, 2, 2e, 3, 4, or flex) cross-connect capacity of a large-slot board is 1 Tbit/s. The cross-connect capacity of the subrack is 10 Tbit/s.
The VC-4 cross-connect capacity of a large-slot board is 160 Gbit/s. The cross-connect capacity of the subrack is 1.6 Tbit/s.
The packet cross-connect capacity of a large-slot board is 400 Gbit/s. The cross-connect capacity of the subrack is 4 Tbit/s.
The OSUflex cross-connect capacity of a large-slot board is 1 Tbit/s. The cross-connect capacity of the subrack is 10 Tbit/s.
Backup mode Two CXCS boards and two CXP boards form a cross-connect resource pool to implement service grooming. If more than one cross-connect board become faulty, the system will fail.
Mechanical Specifications
Dimensions (W x H x D, mm) 477.3 x 30.5 x 220.0
Weight (kg) 4.05
Typical Power Consumption (W) 220
Maximum Power Consumption (W) 250
Additional information
Features

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